CLEANING AGENT, CLEANING AGENT MANUFACTURING APPARATUS, METHOD AND SYSTEM OF CLEANING

摘要

PROBLEM TO BE SOLVED: To satisfactorily effectively clean a semiconductor wafer. SOLUTION: Cleaning of a semiconductor wafer 3 is carried out by spraying a cleaning agent 1 together with a carrier gas 37 toward the semiconductor wafer 3 from spray guns 34. The cleaning agent 1 is a solid-liquid sherbet-like material, containing ice particles. The cleaning agent 1 is obtained by cooling a mixed liquid of cleaning pure water 1a and isopropyl alcohol 1b stored in a manufacturing container 7 to the freezing point of water or below by a mechanical freezer 8, while the mixed liquid is stirred by stirring vanes 15. The isopropyl alcohol concentration in the cleaning agent 1 is set at 1 to 80 mass%, while the ice concentration is 0.2 to 99 mass%. The cleaning agent 1 is supplied to pressurization tanks 40 from the manufacturing vessel 7, and then a pressurized gas 35 is supplied to the pressurizing tanks 40 to force-feed the cleaning agent 1 to the spray guns 34 through cleaning agent force feed paths 42.