| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component which hardly makes troubles such as warp occur regardless of the multilayering and thinning of a ceramic green sheet. SOLUTION: If second conductor powder for a wiring pattern layer 6 laminated and formed in a ceramic green sheet 5 is constituted of only a metallic powder particle MP, it rapidly contracts at a baking temperature suitable for ceramic by the diffusion of metallic particles and melting of the particles, thus causing warp or the like. However, if an inorganic compound powder particle CP having an average grain diameter of 500 nm or less is incorporated, it is possible to delay the baking contraction of the wiring pattern layer 6 properly when the ceramic green sheet 5 is formed at a laminated body 30 and baked. As a result, the warp or the like can be suppressed effectively.
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