发明名称 MOLD FOR MOLDING OF DIVISION METHOD OF UPPER PART AND LOWER PART
摘要 PURPOSE: A mold for molding of a division method of an upper part and a lower part is provided to reduce an exchange cost of the mold for molding by improving a structure of the mold for molding. CONSTITUTION: A mold(200) includes an upper portion(28), a lower portion(30), a plurality of combination portions(32), a through-hole(34), and a combination hole(36). The upper portion includes one or more molding spaces(22). The molding spaces(22) are formed by penetrating a top portion and a bottom portion of the upper portion. The lower portion is coupled with the upper portion by using the combination portions. The through-hole is formed at a predetermined position of the upper portion in order to couple the upper portion with the lower portion. The combination hole corresponds to the through-hole.
申请公布号 KR20030041062(A) 申请公布日期 2003.05.23
申请号 KR20010071793 申请日期 2001.11.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, TAE SEONG
分类号 H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L21/56
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