| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing table, that easily and reliably fixes a semiconductor wafer, without using any adhesive sheets for cutting or dividing and can retain each position of divided semiconductor chips, and to provide a dicing apparatus which uses the dicing table. SOLUTION: The dicing table a plurality of cutting grooves 11, that are provided corresponding to each semiconductor chip 1a, a support wall 12 for supporting the semiconductor chips 1a that are provided along the circumference of each cell formed by the cross of the plurality of cutting grooves 11, a suction hole 13 for sucking gas in a space that is surrounded by the support wall 12 to each semiconductor chip 1a for retaining, and a support post 14 for supporting each semiconductor chip, that is provided at the center section of each cell. A semiconductor wafer 1 during dicing treatment and the semiconductor chip 1a after division are fixed surely onto a dicing table 2, so long as vacuum suction in a recess 10 of each cell continues. |
