发明名称 COOLING STRUCTURE OF ELECTRONIC CIRCUIT PACKAGE AND HEAT SINK
摘要 PROBLEM TO BE SOLVED: To solve the problem that a screw, a heat conductive mat, and the like are needed as the fixing member of a heat sink, and a number of man-hours are required in tap machining to the heat sink and assembling for fixing the heat sink to a printed wiring board. SOLUTION: There are a heat sink 13 of which the surface is flat and wherein a plurality of projections 16 having the same height are provided on its back, and a plurality of engagement sections 1 are provided at its periphery, and a printed wiring board 11 where a plurality of holes 14 in which engagement sections 17 are fitted are formed and an grounded surface 15 is provided on its lower surface. A projection 16 is brought into contact with the upper surface of an electronic circuit package 12 that is mounted onto the upper surface of the printed wiring board 11, and the engagement sections 17 are fitted to the holes 14 for bringing the engagement sections 17 into contact with the grounded surface 15.
申请公布号 JP2003152365(A) 申请公布日期 2003.05.23
申请号 JP20010348605 申请日期 2001.11.14
申请人 OKI ELECTRIC IND CO LTD 发明人 MAEDA NAOAKI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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