METHOD, MECHANISM, AND DEVICE FOR PARTING PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To improve the yield of a circuit board parted from a circuit board of multiple allocation by reducing stress applied to electronic parts mounted on a printed board having lug sections near a parted position of the printed board. SOLUTION: After parting grooves 3 are formed at the printed board 2 by using a pre-parting machine (pre-parting section) 20 and a parting and removing section 30, lug sections 2b at both end sections of the printed board 2 are removed by parting. The pre-parting machine 20 has a pair of left and right disk cutters 23 positioned at the parted positions of the printed board 2 and a pre-parting stage 21 which supports the board 2 at the inside of the board 2 more inner than the parted positions and forms the parting grooves 3 at the parted positions of the board 2. The parting and removing section 30 is provided with a parting machine 35 having a press-cutter 124 which removes the lug sections 2b of the board 2 by parting at the parted positions of the board 2 and a stage 33 which supports the board 2 at the inside of the board 2 more inner than the parted positions.