| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem wherein relatively long time is needed since a chucking means (8) is required to be moved in an X-axis direction to detect the oblique angle of an object to be machined in the conventional alignment method in an object (90) to be machined, such as a semiconductor wafer (98). SOLUTION: A chuck means is relatively positioned to a pair of cutting means (28a, 28b), in a state where each of a pair of imaging means (60a, 60b) images at least one portion of each of two specified rectangular regions (110a, 110b), that are separated in a Y-axis direction on the surface of the object to be machined. The image, that is imaged by each of the pair of imaging means, is processed by an image processing means, and a position in X and Y axes of each of specified sites (112a, 112b), in a specified rectangular region, is detected. Based on the position in the X and Y axes of each specified site in the specified rectangular region, a tilt angleθof streets (100a, 100b) with respect to the X and Y axes is calculated.</p> |
