| 摘要 |
PROBLEM TO BE SOLVED: To form a bump by connecting a ball to a pad part of an IC with high reliability without needing heat from the outside. SOLUTION: In a bump bonding technique, a ball as a bump is formed at a top end of a gold wire 1 led out from a capillary 2, and this ball is pressed against a pad part of an IC 3 and simultaneously an ultrasonic vibration is imparted via the capillary 2 by an ultrasonic head 7 to connect a metal to form the bump of the IC 3. The ultrasonic vibration is imparted at 130 to 320 kHz under normal temperatures and normal pressure, preferably 170 to 270 kHz, more preferably 230±10 kHz, to connect a metal, so that the bump can be formed with an excellent connected state with respect to an IC 3 having lower heat-resistive temperatures as well. Further, the bump can be formed with good positional accuracy without exerting thermal influences on the periphery, and the bump with high reliability can be formed with respect to the minute IC 3 as well. |
