METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board by which small openings of a solder resist layer provided on a wiring board can be formed with accuracy. SOLUTION: The wiring board 101 is provided with the solder resist layer 127 having main surface-side second openings 129 of diameters of <=60μm. This method of manufacturing the wiring board includes an opening forming step of forming the openings 129 by means of a laser beam.