发明名称 ELECTRONIC EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a reliable structure having superior cooling performance in a structure for cooling the heat generation element of electronic equipment by liquid circulation. SOLUTION: A water-cooled jacket 8 is thermally connected to a heat generation element 7, and at the same time, a radiation pipe 9 is thermally connected to a heat sink 10 that is installed at the backside of a display 2, and coolant liquid is made to circulate between the water-cooled jacket 8 and the radiation pipe 9 by a liquid-driven apparatus 11. The water-cooled jacket 8 has a jacket base channel one-piece structure formed by die casting and a water-cooled jacket piping channel one-piece structure formed of a jacket base and metal pipe junction.</p>
申请公布号 JP2003152376(A) 申请公布日期 2003.05.23
申请号 JP20010345507 申请日期 2001.11.12
申请人 HITACHI LTD 发明人 OHASHI SHIGEO;KONDO YOSHIHIRO;MINAMITANI RINTARO;OSANAWA TAKASHI;YOSHITOMI YUJI;NAKANISHI MASATO;SASAKI YASUHIKO;NAKAGAWA TAKESHI
分类号 G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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