| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and the manufacturing method of the same capable of improving a level of integration, by forming a wiring pattern on the whole of upper surface of a multilayer board without necessitating any expensive manufacturing facility. SOLUTION: The semiconductor device unit 54, in which a semiconductor element 70 is mounted on a two-layer board, is piled on the semiconductor unit 53, in which the semiconductor element 70 is mounted on the two-layer board, through lamination bumps 80, 80,... and ACFs 64 arranged around the bumps. Then the units 53, 54 are connected electrically.</p> |
