POLISHING PAD CONDITIONER OF CHEMICAL MECHANICAL POLISHER, AND METHOD OF CONDITIONING POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad conditioner for restoring the surface of a polishing pad to its original state, when the polishing pad used for chemical mechanical polishing of the surface of a wafer has become a defective planarization, and also to provide a method of conditioning the polishing pad. SOLUTION: The polishing pad conditioner comprises a bite 26 provided with a grinding chip 27 at the tip; a horizontal movement means, which comprises a horizontal slide section 32 for fixing the bite 26 and moving nearly in parallel with the surface of a polishing pad 24 and a horizontal case section 34 for guaranteeing the moving path of the horizontal slide 32; a base section 42 for supporting the horizontal case 34 of the horizontal movement means; and a vertical movement means, consisting a first level screw 28 for adjusting the position of the bite 26 in the vertical directions. The polishing pad conditioner also comprises a tilt adjustment means which comprises a second level screw 38 installed at one end of the base section 42, to adjust an angle formed by a horizontal moving path of the horizontal slide 32 and the surface of the polishing pad 24, and a hinge joint section 36 for fixing one point of the horizontal case 34 to the base section 42.