| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for dismounting a ball grid array mounted on a printed wiring board, which is capable of reducing thermal damage to the printed wiring board and parts mounted on the wiring board around the BGA to an irreducible minimum. SOLUTION: This method of dismounting a ball grid array 12 mounted on a printed wiring board comprises a first step of arranging the printed wiring board 10 so as to position the ball grid array 12 inside a solder jet nozzle 8, a second step of bringing molten solder 24 inside the solder jet nozzle 8 into contact with the main body of the ball grid array 12 to melt the solder balls 26 of the ball grid array 12 by heat conduction of the main body, and a third step of dismounting the ball grid array 12 to a molten solder 24 side.
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