发明名称 STRUCTURE FOR MOUNTING ELECTRONIC CIRCUIT PACKAGE
摘要 PROBLEM TO BE SOLVED: To make a wiring board smaller in size and height in a structure for mounting an electronic circuit package where a plurality of electronic circuit packages are arranged like a bookshelf to form electronic circuit equipment. SOLUTION: An electronic circuit package 1 is comprised of upper and lower wiring boards 7a and 7b and a plurality of power supply connectors 8aa to 8ax and 8ba to 8bx for connecting the power supply wirings or planes of both wiring boards. The wiring board 7a is formed by laminating a number of wiring layers where a plurality of package connectors 6a to 6e for signal connection between a plurality of logic circuits 2a to 2h and the outside of the electronic circuit package are mounted and which form both signal wiring connection and power supply connection. The wiring board 7b is provided with a voltage conversion circuit that converts a power supply supplied from the outside of the electronic circuit package to a potential wherein the logic circuit operates, and it is comprised of only a few number of power supply wiring layers. A power supply after conversion is supplied to the logic circuits through the respective power supply connectors.
申请公布号 JP2003152300(A) 申请公布日期 2003.05.23
申请号 JP20010344269 申请日期 2001.11.09
申请人 NEC COMMUN SYST LTD;JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 SATO KATARO;HAKETA OSAMU;KASHIWAGI SHIGERU
分类号 H05K7/20;H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K7/20
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