TAPE CARRIER FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD AS WELL AS SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device in which a solder ball can be formed rigidly to a solder ball land and to provide a method for manufacturing the same and the semiconductor device having high reliability constituted by using the tape carrier. SOLUTION: The tape carrier of this type comprises a via hole 4 for forming the solder ball on the solder ball land 5, and a plating film 6 of an Au-Ni formed on a wiring layer 2 by dipping in a placing liquid in such a manner that the plating film is not formed on the land 5.