| 摘要 |
PROBLEM TO BE SOLVED: To provide a versatile wafer transfer apparatus which is applicable in both conventional after-dicing and front-dicing, and is capable of transferring a wafer pasted with a protective tape onto a dicing tape and a ring frame continuously and automatically regardless of the type of the protective tape and the dicing tape to be used and which allows a protective tape to be easily peeled off. SOLUTION: The wafer transfer apparatus comprises a first ultraviolet ray irradiation unit for radiating ultraviolet rays on a protective tape, positioning unit for positioning a wafer, mount unit to be integrated with a ring frame, protective tape peeling unit for peeling the protective tape off from the surface of the wafer, and a second ultraviolet ray irradiation unit for radiating ultraviolet rays on a dicing tape. |
