| 摘要 |
PROBLEM TO BE SOLVED: To reinforce a key plate portion by a simple method to prevent the warpage of a printed wiring board and a multi-layer printed wiring board during reflow. SOLUTION: In this printed wiring board, a metallic reinforcing plate is buried at the center inside a key plate portion 2 that is formed in the outer periphery of a printed board body 1. In addition, another metallic reinforcing plate is buried in the key plate portion in at least one layer of a printed wiring board of laminated printed wiring board in the multi-layer printed wiring board 1. The key plate portion is provided with perforation for discarding or a V groove. |
