| 摘要 |
<p>A circuit board which prevents not only a decrease in peeling strength but also an increase in connection resistance with a conductive material even in the case of a reduction in contact area when a copper foil is used for the circuit board. To realize this circuit board, an insulation base material (101) having through holes filled with a conductive material (104) is overlaid with a metal film (105) coating the through hole in at least one face of the insulation base material (101). The metal film (105) has a rugged layer (106) with a size of 5μm or more over the front surface. Another metal layer is formed over the opposite face of the rugged layer (106).</p> |
