| 摘要 |
A semiconductor device capable of reducing the signal loss caused in a pad of a semiconductor substrate. The semiconductor substrate 100 includes a pad 112 formed on a semiconductor substrate 110, an FET 114 for receiving the signal input to this pad 112, a capacitor 116 inserted between the pad 110 and the FET 114, and a switching element 122 connected in parallel to the capacitor 116. During a test, the switching element 122 is turned on to shortcircuit between the pad 112 and the gate of FET 114.
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