发明名称 |
Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
摘要 |
A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providing a resin layer (14) as a stress relieving layer on the wafer (10), avoiding the electrodes (12); a step of forming a chromium layer (16) as wiring from electrodes (12) over the resin layer (14); a step of forming solder balls as external electrodes on the chromium layer (16) over the resin layer (14); and a step of cutting the wafer (10) into individual semiconductor chips; in the steps of forming the chromium layer (16) and solder balls, metal thin film fabrication technology is used during the wafer process.
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申请公布号 |
US2003096449(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20020254600 |
申请日期 |
2002.09.26 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO NOBUAKI |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L21/768;H01L23/31;H01L23/36;H01L23/485;H01L23/532;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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