发明名称 CERIUM-BASED POLISH AND CERIUM-BASED POLISH SLURRY
摘要 <p>A polish containing cerium oxide as a principal component, when dispersed in water in an amount of 10 % by mass, has a precipitate bulk specific density in the range of 0.8 g/ml to 1.0 g/ml, having a primary particle size in the range of 40nm to 80nm and a specific surface area in the range of 2m2/g to 5m2/g. The thus obtained polish provides the cerium-based polish and the cerium-based polish slurry that increase the polishing speed and cause few scratches inflicted on the surface of polish and achieve high quality of the polished surfaces.</p>
申请公布号 WO2003042321(A1) 申请公布日期 2003.05.22
申请号 JP2002011925 申请日期 2002.11.15
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