| 摘要 |
PURPOSE: To prevent the occurrence of cracks, ballooning, peeling and voids in a laminating layer when a plated composite material is laminated to an other material by the use of the laminating layer such as a solder layer. CONSTITUTION: After masked, the composite base material is pretreated. Then, the surface of the composite base material is activated, and a metal catalyst is imparted onto the laminated surface of the composite base material and the surface of a masking tape, and thereafter, plated layers are formed on the laminated surface of the composite base material and the surface of the masking tape by electroless plating treatment. The preferable thickness of the plated layers is 5 to 100μm. After removed the masking tape, the composite base material having the plated layer only on the laminated surface is subjected to drying treatment. |
