发明名称 |
MULTICHIP MODULE |
摘要 |
A bondwire transition arrangement for interconnecting a signal port (12) on one IC (10) of a multichip module with a signal port (13) on another, adjacent, IC (11) of the same module employs a distributed signal-transition process in which the signal on one port (12) appears as subsignals at tappin g points along a series transmission-line segment arrangement (30) between tha t port and ground (33) on the same IC (10) and the subsignals are recombined along a second series transmission-line segment arrangement (31) connected between the other port (13) and ground (34) on the other IC (11). Spatially corresponding tapping points are interconnected via bondwires (35).
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申请公布号 |
CA2465296(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
CA20022465296 |
申请日期 |
2002.10.28 |
申请人 |
MARCONI COMMUNICATIONS GMBH |
发明人 |
KOCH, STEFAN;GILL, HARDIAL SINGH;LOHRMANN, ROLF |
分类号 |
H01L25/18;H01L25/04;H01P1/04;(IPC1-7):H01P3/00 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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