发明名称 |
Bare chip mounting method and bare chip mounting system |
摘要 |
A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.
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申请公布号 |
US2003096451(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20020267668 |
申请日期 |
2002.10.10 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TOKUNAGA TETSUYA;YONEZAWA TAKAHIRO;KIYOMURA HIROYUKI;SASAOKA TATSUO;HORIE SATOSHI |
分类号 |
H01L21/60;H01L21/68;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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