发明名称 |
Method and apparatus for defect analysis of wafers |
摘要 |
A method for defect analysis of wafers and a defect analysis system are disclosed. The defect analysis system has an image processing unit and an optical scanning apparatus, which is a flatbed scanner.
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申请公布号 |
US2003095252(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20020300396 |
申请日期 |
2002.11.20 |
申请人 |
LEICA MICROSYSTEMS SEMICONDUCTOR GMBH |
发明人 |
MAINBERGER ROBERT |
分类号 |
G01N21/95;G03F7/20;(IPC1-7):G01N21/00 |
主分类号 |
G01N21/95 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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