发明名称 |
Semiconductor device and manufacturing method of the same |
摘要 |
Concave portions and convex portions are formed on an insulating layer. First bit lines are arranged on the convex portions. A width of the first bit lines is set to L, and a space between the first bit lines is set to L+2S. Each of the first bit lines is electrically connected to a drain diffusion layer by a contact plug. Second bit lines are arranged in a trench between the first bit lines. A width of the second bit lines is set to L, and a space between the first and second bit lines is equal to a width S of a side wall. Each of the second bit lines is electrically connected to a drain diffusion layer by a contact plug.
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申请公布号 |
US2003094632(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20020186173 |
申请日期 |
2002.06.28 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOBAYASHI KAZUHITO;FUKUZAKI YUZO |
分类号 |
H01L21/3205;H01L21/8242;H01L23/522;H01L27/02;H01L27/108;(IPC1-7):H01L21/82;H01L27/10 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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