| 摘要 |
PURPOSE: A spin coater apparatus is provided to apply photoresist before thinner sprayed on the surface of a wafer is volatilized by remarkably reducing a time interval from after the thinner is sprayed from a thinner nozzle until the photoresist discharges from a photoresist nozzle. CONSTITUTION: A spin unit(110) rotates a wafer while the wafer is fixed to the spin unit. At least one first nozzle sprays process solution 1 on the wafer. The second nozzle sprays process solution 2 on the wafer. A nozzle transfer unit(130) selects one of the first nozzles and transfers the selected first nozzle from a standby position to a discharge position on the wafer. A holder is coupled to a supporting block of the selected first spray nozzle and rotates the first spray nozzle while driven by a driving unit(132). The second nozzle is mounted on the holder to rotate from a standby position to a discharge position together with the first spray nozzle.
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