| 摘要 |
PURPOSE: A solder ball manufacturing apparatus for a semiconductor package using an oil dripping type is provided to improve the characteristics of the solder ball by using an oscillator and a heater. CONSTITUTION: A solder ball manufacturing apparatus is provided with a melting tank(10) for storing the ingredients of a solder ball, a stir wing(20) for stirring the ingredients, a tundish(30) connected through the melting tank for storing melted metal supplied from the melting tank, a jetting part(40) installed on the rear surface of the tundish for jetting the melted metal, an oil chamber(50) for cooling the jetted metal, a transfer pipe(60) installed in the oil chamber for transferring the jetted metal, a ball tank(80) installed at the lower portion of the transfer pipe for storing solder balls, and an oil tank(90) for storing the exhausted oil. Preferably, the jetting part(40) further includes an exhaust hole(42) formed at the lower portion of the tundish for exhausting the melted metal and an oscillator(41) for switching the exhaust hole. At this time, the melted metals are sequentially exhausted by the oscillator. Preferably, a heater(61) is installed on the upper portion of the transfer pipe for directly heating the peripheral oil of the transfer path of the jetted metal.
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