发明名称 SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING IT
摘要 A semiconductor component includes a first layer and at least one adjacent semiconductor layer or metallic layer, which forms a rectifying junction with the first layer. Further semiconductor layers and metallic layers are provided for contacting the component. Insulating or semi-insulating structures are introduced into the first layer in a plane parallel to the rectifying junction. These structures are shaped like dishes with their edges bent up towards the rectifying junction. A method of producing such a semiconductor component is also provided.
申请公布号 US2003094623(A1) 申请公布日期 2003.05.22
申请号 US20010861427 申请日期 2001.05.18
申请人 KAPELS HOLGER;SILBER DIETER;PLIKAT ROBERT 发明人 KAPELS HOLGER;SILBER DIETER;PLIKAT ROBERT
分类号 H01L29/06;H01L29/40;H01L29/739;H01L29/78;(IPC1-7):H01L29/74;H01L27/01;H01L27/12 主分类号 H01L29/06
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