发明名称 |
SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING IT |
摘要 |
A semiconductor component includes a first layer and at least one adjacent semiconductor layer or metallic layer, which forms a rectifying junction with the first layer. Further semiconductor layers and metallic layers are provided for contacting the component. Insulating or semi-insulating structures are introduced into the first layer in a plane parallel to the rectifying junction. These structures are shaped like dishes with their edges bent up towards the rectifying junction. A method of producing such a semiconductor component is also provided.
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申请公布号 |
US2003094623(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20010861427 |
申请日期 |
2001.05.18 |
申请人 |
KAPELS HOLGER;SILBER DIETER;PLIKAT ROBERT |
发明人 |
KAPELS HOLGER;SILBER DIETER;PLIKAT ROBERT |
分类号 |
H01L29/06;H01L29/40;H01L29/739;H01L29/78;(IPC1-7):H01L29/74;H01L27/01;H01L27/12 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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