发明名称 Method for producing prepreg, preprig, metal-clad laminate and printed wiring board
摘要 There are disclosed a method of preparing a prepreg comprising the steps of a impregnation process in which a thermosetting resin varnish is impregnated into a fiber base material and a drying step in which a solvent of the impregnated thermosetting resin varnish in the fiber base material is vaporized and the resin is semi-cured, wherein the drying step is carried out by moving the fiber base material into which the thermosetting resin varnish is impregnated with a tensile force of 3.0 N/cm or less; and a prepreg prepared by the method.
申请公布号 US2003094232(A1) 申请公布日期 2003.05.22
申请号 US20020220426 申请日期 2002.09.03
申请人 SAITOU TAKESHI;HANAWA AKINORI;MATSUZAKI TAKASHI;SUDOU MORIMICHI 发明人 SAITOU TAKESHI;HANAWA AKINORI;MATSUZAKI TAKASHI;SUDOU MORIMICHI
分类号 B29B15/12;C08J5/24;H05K3/02;(IPC1-7):B32B15/08 主分类号 B29B15/12
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