发明名称 |
Method for producing prepreg, preprig, metal-clad laminate and printed wiring board |
摘要 |
There are disclosed a method of preparing a prepreg comprising the steps of a impregnation process in which a thermosetting resin varnish is impregnated into a fiber base material and a drying step in which a solvent of the impregnated thermosetting resin varnish in the fiber base material is vaporized and the resin is semi-cured, wherein the drying step is carried out by moving the fiber base material into which the thermosetting resin varnish is impregnated with a tensile force of 3.0 N/cm or less; and a prepreg prepared by the method.
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申请公布号 |
US2003094232(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20020220426 |
申请日期 |
2002.09.03 |
申请人 |
SAITOU TAKESHI;HANAWA AKINORI;MATSUZAKI TAKASHI;SUDOU MORIMICHI |
发明人 |
SAITOU TAKESHI;HANAWA AKINORI;MATSUZAKI TAKASHI;SUDOU MORIMICHI |
分类号 |
B29B15/12;C08J5/24;H05K3/02;(IPC1-7):B32B15/08 |
主分类号 |
B29B15/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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