发明名称 Field effect transistor assemblies, integrated circuitry, and methods of forming field effect transistors and integrated circuitry
摘要 The invention encompasses integrated circuitry which includes a semiconductive material substrate and a first field effect transistor supported by the substrate. The first field effect transistor comprises a first transistor gate assembly which includes a first layer of conductively doped semiconductive material and only one layer of conductive nitride. The integrated circuitry further comprises a second field effect transistor supported by the substrate. The second field effect transistor comprises a second transistor gate assembly which includes a second layer of conductively doped semiconductor material and at least two layers of conductive nitride. The invention also encompasses a field effect transistor assembly which includes a channel region and an insulative material along the channel region. The transistor assembly further includes a gate stack proximate the channel region. The gate stack includes a first conductive nitride layer separated from the channel region by the insulative material. The stack further includes a conductively doped semiconductive material proximate the first conductive nitride layer, and a second conductive nitride layer separated from the first conductive nitride layer by the conductively doped semiconductive material. Additionally, the invention encompasses methods of forming field effect transistors, and methods of forming integrated circuitry.
申请公布号 US2003094633(A1) 申请公布日期 2003.05.22
申请号 US20020300153 申请日期 2002.11.19
申请人 GONZALEZ FERNANDO;MOULI CHANDRA 发明人 GONZALEZ FERNANDO;MOULI CHANDRA
分类号 H01L21/28;H01L21/8234;H01L21/8238;H01L29/423;H01L29/49;H01L29/51;(IPC1-7):H01L27/10 主分类号 H01L21/28
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