ELECTRONIC DEVICE CARRIER ADAPTED FOR TRANSMITTING HIGH FREQUENCY SIGNALS
摘要
An electronic device carrier (110) adapted for transmitting high−frequency signals, including a circuitized substrate with a plurality of conductive layers (240a to 240g) insulated from each other, the conductive layers being arranged in a sequence from a first one of the conductive layers (240a) wherein a plurality of signal tracks (200) each one ending with a contact area (205) for transmitting a high−frequency signal are formed, and a reference structure (215a, 215b, 230) connectable to a reference voltage or ground for shielding the signal tracks the reference structure includes at least one reference track (230) formed in a second one of the conductive layers (240b) adjacent to the first conductive layer and at least one further refer­ence track formed in one of the conductive layers (240d) different from the first and second conductive layer, a portion of each signal track excluding at least the area corresponding to the orthographic projection of associated contact area being superimposed in plan view to a corre­sponding reference track and at least a part of the area corresponding to the orthographic projection of the contact area associated to each signal track being superimposed in plan view to a corresponding further reference track with interposition of a floating conductive track, i.e. a track not connected to any signal, reference voltage or ground track.
申请公布号
WO03043085(A2)
申请公布日期
2003.05.22
申请号
WO2002EP13209
申请日期
2002.10.25
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;COMPAGNIE IBM FRANCE;ALCOE, DAVE;NOWAK, RONALD;PREDA, FRANCESCO;OGGIONI, STEFANO, SERGIO