| 摘要 |
<p>The present invention described a method of adhering titanium metal layer to substrate surface, comprising : (a) providing heating apparatus and diffusion layer in chamber ; (b) utilizing platform with through holes which connected to air purge unit ; (c) placing adhesive layer (solid under room temperature) and titanium metal layer ; (d) heating chamber to predetermined temperature by heating apparatus and diffusion layer ; permitting heating energy generated by heating apparatus permeating through diffusion layer so as to homogeneously conducting to titanium metal layer ; adhesive layer and substrate, melting adhesive layer and rarefying air in chamber ; (e) sucking through holes by air purge unit, permitting titanium and adhesive layer adhering together to substrate surface smoothly and strongly due to suction.</p> |
