发明名称 MEMS DEVICE HAVING CONTACT AND STANDOFF BUMPS AND RELATED METHODS
摘要 <p>According to one embodiment, a movable MEMS component (100) suspended over a substrate (102) is provided. The component (100) can include a structural layer (112) having a movable electrode (114) separated from a substrate (102) by a gap. The component (100) can also include at least one standoff bump (118) attached to the structural layer (112) and extending into the gap for preventing contact of the movable electrode (114) with conductive material when the component moves.</p>
申请公布号 WO2003043038(A2) 申请公布日期 2003.05.22
申请号 US2002035927 申请日期 2002.11.08
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