发明名称 MONOMER, POLYMER AND PHOTORESIST RESIN COMPOSITION FOR CHEMICAL AMPLIFICATION TYPE NEGATIVE PHOTORESIST
摘要 PURPOSE: A monomer, a polymer prepared by using the monomer and a photoresist resin composition containing the polymer for the chemical amplification type negative photoresist are provided, to improve the sensitivity and to prevent the swelling during development. CONSTITUTION: The monomer is represented by the formula 1, wherein R1 and R2 are H, CH3, OH, CH2OH, COOCH3 or COOC(CH3)3, respectively; R3 is blank or is a saturated alkyl group of C1-C5, an ether group of C1-C5, a carbonyl group of C1-C5 or an alcohol group of C1-C5; and R4 is a saturated alkyl group of C1-C5, an ether group of C1-C5, a carbonyl group of C1-C5 or an alcohol group of C1-C5. Preferably the polymer is represented by the formula 2, 3 or 4, wherein a and b are 0.01-0.49, respectively, c is 0.5 and a+b is 0.5; d, e and f are 0.01-0.48, respectively, g is 0.5, and d+e+f is 0.5; and n is a degree of polymerization. The photoresist resin composition comprises 10-20 wt% of the polymer; and 0.1-5.0 wt% of a photoacid generator.
申请公布号 KR20030039877(A) 申请公布日期 2003.05.22
申请号 KR20010071247 申请日期 2001.11.16
申请人 SAMSUNG SDI CO., LTD. 发明人 LEE, BEOM UK;LIM, IK CHEOL;YOO, SEUNG JUN
分类号 G03F7/039 主分类号 G03F7/039
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