| 发明名称 |
Process for producing a semiconductor chip |
| 摘要 |
A process for producing a semiconductor chip having contact elements protruding on one chip side within the context of wafer level packaging, the chip side provided with the contact elements being coated with a covering compound forming a protective layer, from which the protruding contact element project.
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| 申请公布号 |
US2003094695(A1) |
申请公布日期 |
2003.05.22 |
| 申请号 |
US20020284649 |
申请日期 |
2002.10.31 |
| 申请人 |
HEDLER HARRY;IRSIGLER ROLAND;VASQUEZ BARBARA |
发明人 |
HEDLER HARRY;IRSIGLER ROLAND;VASQUEZ BARBARA |
| 分类号 |
H01L23/04;H01L21/56;H01L21/68;H01L23/31;H01L23/485;(IPC1-7):H01L23/48;H01L21/44 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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