发明名称 METHOD OF FILLING A WELL IN A SUBSTRATE
摘要 <p>The invention relates to a method of filling a well (including a channel) in a substrate. In accordance with the invention liquid is applied on a substrate comprising a well on a position that does not coincide with the well, and the well after filling is sealed with a cover means, wherein liquid is applied on a position between the front of the cover means and the well that is not covered by the cover means, and with the aid of the cover means the liquid is pushed into the well.</p>
申请公布号 WO2003041863(A2) 申请公布日期 2003.05.22
申请号 NL2002000737 申请日期 2002.11.15
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