| 摘要 |
A pin grid array integrated circuit connecting device which comprises a substrate, a sliding slice, a guiding frame and a driving apparatus. Said substrate further comprises multiple holes to hold pins of a integrated circuit package, multiple conductive positioning components in the holes to hold said pins and connect said pins electrically, circuit device with proper circuit layout and multiple electrical connecting spots on the bottom of said substrate which connecting said multiple conductive positioning components thru said circuit device. The extra electronic components placed on said substrate will provide the additional function. Said sliding slice is placed on the top of said substrate and can be moved relatively. Multiple holes are placed on said sliding slice and positioned correspondingly to the holes on said substrate. Said guiding frame is placed on at least the two opposite sides of said substrate which guide said sliding move linearly along the extension of said guiding frame. Said driving apparatus is connecting to said sliding slice and, by rotating horizontally, drive said sliding slice to move in a proper manner linearly.
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