| 摘要 |
The wafer clamping apparatus is disclosed including a cam rotatably coupled to a base plate. The cam is configured to couple with a robot arm. The clamping apparatus also includes a rotating clamp mechanism rotatably coupled to the base plate about a single fixed point. A biasing mechanism, coupled to the rotating clamp mechanism, urges the rotating clamp mechanism towards a clamped position. The rotating clamp mechanism is configured to interact with the cam to engage and disengage the rotating clamp mechanism from the clamped position. The rotating clamp mechanism preferably comprises a hub rotatably coupled to the base plate and a clamping arm and cam follower extending from the hub. The clamping arm is configured to clamp a wafer when the rotating clamp mechanism is in the clamped position, while the cam follower is configured to interact with the cam.
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