发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>A laser beam machining device, wherein one laser beam (26) is divided into two laser beams (26a, 26b) by a first polarization means (25), one is passed through mirrors (24) and the other is scanned in dual axis directions by a first galvano-scanner (29), and the two laser beams (26a, 26b) are scanned by second galvano-scanners (30) after being led to a second polarization means (27) to machine a work (22), an optical path being so formed that the laser beam (26b) passed through the first polarization means (25) is reflected by the second polarization means (27) and the laser beam (26a) reflected by the first polarization means (25) is passed through the second polarization means (27).</p>
申请公布号 WO2003041904(P1) 申请公布日期 2003.05.22
申请号 JP2002011838 申请日期 2002.11.13
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