| 摘要 |
<p>A semiconductor device capable of reducing the signal loss caused in a pad of a semiconductor substrate. The semiconductor substrate (100) includes a pad (112) formed on a semiconductor substrate (110), an FET (114) for receiving the signal input to this pad (112), a capacitor (116) inserted between the pad (110) and the FET (114), and a switching element (122) connected in parallel to the capacitor (116). During a test, the switching element (122) is turned on to shortcircuit between the pad (112) and the gate of FET (114).</p> |
