SYSTEM AND METHOD FOR READING INFORMATION OF SEMICONDUCTOR CHIP

摘要

PURPOSE: A system for reading the information of a semiconductor chip is provided to obtain the same result without reading the information regarding the semiconductor chip in a burn-in test by merging the information file generated in a DC test with the information file generated in the burn-in test. CONSTITUTION: A loader/unloader(100) loads/unloads a semiconductor package for a test. A DC tester(200) screens a defect in assembling the semiconductor package and reads the information of the semiconductor chip written inside the semiconductor package, installed in an input portion of the loader. A monitoring amp burn-in tester(MBT) system(300) performs a burn-in process at various temperatures after a defective semiconductor package is eliminated. A burn-in server(500) stores the result of the burn-in process regarding the semiconductor package. An integrated fabrication performing system(400) stores the data necessary for a semiconductor package fabricating process. A gamma server(600) stores and merges the information regarding the semiconductor chip obtained from the DC tester and the information obtained from the MBT system. The loader/unloader receives the information regarding the semiconductor chip obtained from the integrated fabrication performing system and the information regarding a board into which the semiconductor package is inserted from the MBT system by using the burn-in server as a medium. And the loader/unloader transmits the information to the DC tester. The gamma server merges the DC test result transmitted from the DC tester with the MBT result transmitted from the MBT system through the burn-in server.