发明名称 |
Backside protection films |
摘要 |
Disclosed is a method of fabricating a semiconductor device, comprising: (a) providing a bare semiconductor substrate, the substrate having a frontside and a backside; (b) forming one or more protective films on the backside of the substrate; and (c) performing one or more wafer fabrication steps. Some or all the protective films may be removed and the method repeated multiple times during fabrication of the semiconductor device.
|
申请公布号 |
US2003096507(A1) |
申请公布日期 |
2003.05.22 |
申请号 |
US20010989389 |
申请日期 |
2001.11.20 |
申请人 |
BAKER FAYE D.;GRANT CASEY J.;ISHAQ MOUSA H.;SHARROW JOEL M.;WEIL JAMES D. |
发明人 |
BAKER FAYE D.;GRANT CASEY J.;ISHAQ MOUSA H.;SHARROW JOEL M.;WEIL JAMES D. |
分类号 |
H01L21/316;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/316 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|