Substrates and assemblies including pre-applied adhesion promoter

摘要

An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.