Heat sink for cooling power component on circuit board, has recess which receives power component, while establishing thermal contact between planar surfaces of heat sink and circuit board

摘要

The heat sink is formed from thermally conductive material for receiving lost heat from the power component, and supplying the heat to the surrounding medium. The heat sink has a recess (20), and at least one planar surface (30,40) arranged so that the heat sink can be placed on a circuit board mounted with the power component, so as to receive the power component in the recess, while establishing thermal contact between the planar surfaces and the circuit board. Independent claims are also included for: (1) a method of manufacturing a heat sink; and (2) a method of cooling a power component.