| 发明名称 |
Circuit substrate and its manufacturing method |
| 摘要 |
A circuit substrate has a flexible thin film, electric wires supported on the film, and an electric component supported on the film and positioned between the wires so that the wires and the components are electrically connected serially. Also, a thickness of the component is less than that of the electric wire.
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| 申请公布号 |
US2003094697(A1) |
申请公布日期 |
2003.05.22 |
| 申请号 |
US20020300028 |
申请日期 |
2002.11.20 |
| 申请人 |
HIGASHIDA TAKAAKI;OKUMA TAKAFUMI;SUETSUGU DAISUKE;NAKASHIMA SEIJI;YAMAMOTO KENICHI;NISHIHARA MUNEKAZU;SATO KENICHI |
发明人 |
HIGASHIDA TAKAAKI;OKUMA TAKAFUMI;SUETSUGU DAISUKE;NAKASHIMA SEIJI;YAMAMOTO KENICHI;NISHIHARA MUNEKAZU;SATO KENICHI |
| 分类号 |
H05K3/46;H01L23/538;H05K1/05;H05K1/16;H05K1/18;H05K3/00;(IPC1-7):H01L23/48 |
主分类号 |
H05K3/46 |
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