发明名称 |
MATERIAL FOR DRAWING MINUTE PATTERN AND METHOD FOR MINUTE PROCESSING USING THE MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a material for minute processing and a method for minute processing using the material which realize dimensions of processing exceeding by far the limit of diffraction by using an existing low-cost laser light source, without necessitating the use of expensive and large-scale equipment. SOLUTION: The material for drawing a minute pattern has a composite layer which is composed of a layer of at least one kind of inorganic substance (A) and of a layer of at least one kind of inorganic substance (B) reacting with the inorganic substance (A) under irradiation of light and is provided on a base. A substance produced after the reaction has an etching rate different from that of the inorganic substance (A) or (B). After the substance having the etching rate different from that of the inorganic substance (A) or (B) is produced by irradiating the material with a narrowed beam light, etching is executed with the difference in the etching rate utilized, so as to conduct the minute processing. |
申请公布号 |
JP2003145941(A) |
申请公布日期 |
2003.05.21 |
申请号 |
JP20010352070 |
申请日期 |
2001.11.16 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;SHARP CORP;TDK CORP |
发明人 |
KUWABARA MASASHI;TOMINAGA JUNJI;ATODA NOBUFUMI;FUJI HIROSHI;KIKUKAWA TAKASHI |
分类号 |
G03F7/004;B41M5/26;G11B7/26 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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