| 摘要 |
PROBLEM TO BE SOLVED: To provide a relatively simple plating apparatus in which the temperature of a plating solution in the process of plating is more uniformly controlled to easily form a uniform plating film on the face to be plated in the material to be treated, and a foot print can be reduced. SOLUTION: The plating apparatus has a plating tank 18 with a double tank structure having an inner tank 14 retaining a plating solution 12 at the inside, and performing plating treatment, and an outer tank 26 surrounding the circumference of the inner tank 14, and communicated with the inner tank 14, and a heating apparatus 30 arranged at the inside of the outer tank 26. If required, the apparatus has a means 32 of circulating or stirring the plating solution 12 at the inside, and stopping the flow of the plating solution 12 at the inside of the plating tank 18 on plating treatment.
|
