SEMICONDUCTOR LASER DEVICE

摘要

A semiconductor laser device comprising a semiconductor laser element, a lead frame having an element disposing section where elements are disposed, and a resin bonded to the lead frame, wherein the lead frame has a thick portion and a thin portion, the thick portion being formed to extend at least in the direction of the width of the resin to cover a region having a length equal to or greater than this width. Thereby, the thick-walled construction of the lead frame improves heat dissipation and strength. Also, it stabilizes the positioning reference plane and improves the accuracy of attachment. A semiconductor laser device has a semiconductor laser element, a lead frame having an element mount portion on which the semiconductor laser element is mounted, and a resin kept in intimate contact with the lead frame. The lead frame has a thicker portion and a thinner portion, and the thicker portion is so formed as to extend, in the direction of the width of the resin, over a width equal to or greater than the width of the resin. The thicker portion of the lead frame ensures improved heat dissipation and mechanical strength. Stable reference surfaces for positioning ensure improved fitting accuracy.