EPOXY RESIN COMPOSITION HAVING LOW PERMITTIVITY

摘要

PROBLEM TO BE SOLVED: To provide a low-cost epoxy resin composition which can achieve a material with a low permittivity for an insulating layer of a printed wiring board. SOLUTION: The epoxy resin composition having a low permittivity contains an epoxy resin having at least one epoxy group in the molecule, hollow plastic particles, and an epoxy curing agent.